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大山吉郎さん: 目指せ!特許翻訳の達人
ハンドル名大山吉郎 さん
ブログタイトル目指せ!特許翻訳の達人
ブログURLhttp://ameblo.jp/tokkyohonyaku/
サイト紹介文毎日、数行の米国特許の英文と、該当する私の翻訳例及びコメントを公開します。
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更新頻度(1年)情報提供364回 / 365日(平均7.0回/週) - 参加 2013/12/19 11:49

大山吉郎 さんのブログ記事

  • 2017.07.17
  • 新しい明細書の勉強に入ります。英文及び翻訳例Improved Multipole Magnet【書類名】明細書【発明の名称】改良された多極マグネット   This invention relates to an improved multipole magnet, and more specifically, although not exclusively, to an improved multipole magnet that includes permanent magnets and is suitable for deflecting, focusing or otherwise altering the characteristics of a beam of charg [続きを読む]
  • 2017.07.16
  • 英文及び翻訳例20.  A method for securing an electrical subassembly (ESA) of a parallel optical communications device to a
    n optical subassembly (OSA) of the parallel optical communications device, the method comprising:【請求項20】 並列光
    通信装置の電気サブアセンブリー(ESA)を前記並列光通信装置の光学サブアセンブリー(O
    SA)に固定する方法であって、   mounting a mounting device of an ESA [続きを読む]
  • 2017.07.15
  • 英文及び翻訳例After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the
    upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective s
    lots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the
    OSA and the ESA [続きを読む]
  • 2017.07.14
  • 英文及び翻訳例   ABSTRACT OF THE DISCLOSURE   A parallel optical communications device is provided that has an
    OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable ins
    ert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable in
    sert.【書類名】要約書 [続きを読む]
  • 2017.07.13
  • 英文及び翻訳例19.  The method of claim 14, wherein said at least one slot formed in the lower surface of said at least one heat dissipation block is greater in a width dimension than a width dimension of said at least one slot formed in the upper surface of the mounting device, and wherein said at least one weldable OSA insert is greater in at least a width dimension than a width dimension of sa [続きを読む]
  • 2017.07.12
  • 英文及び翻訳例18.  The method of claim 14, wherein said at least one slot formed in the lower surface of said at least one heat dissipation block is smaller in a width dimension than a width dimension of said at least one slot formed in the upper surface of the mounting device, and wherein said at least one weldable OSA insert is smaller in a width dimension than a width dimension of said at lea [続きを読む]
  • 2017.07.11
  • 英文及び翻訳例17.  The method of claim 16, wherein the surface area of the lower surface of said at least one weldable OS
    A insert is less than or equal to about 35% of the surface area of the lower surface of said at least one heat dissipation block.
    【請求項17】 前記少なくとも1つの溶接可能なOSA挿入部の下面の表面積が、前記少なく
    とも1つの熱放散ブロックの下面の表面積の約35%以下である、請 [続きを読む]
  • 2017.07.10
  • 英文及び翻訳例16.  The method of claim 15, wherein the surface area of the lower surface of said at least one weldable OS
    A insert is no greater than 50% of the surface area of the lower surface of said at least one heat dissipation block.【請求項
    16】 前記少なくとも1つの溶接可能なOSA挿入部の下面の表面積が、前記少なくとも1つ
    の熱放散ブロックの下面の表面積の約50%以下である、請求項15に記 [続きを読む]
  • 2017.07.09
  • 英文及び翻訳例15. The method of claim 14, wherein said at least one weldable OSA insert has a lower surface that is gener
    ally co-planar with the lower surface of said at least one heat dissipation block, and wherein the lower surface of said at least
    one weldable OSA insert has a surface area that is relatively small compared to a surface area of the lower surface of said at lea
    st one heat diss [続きを読む]
  • 2017.07.08
  • 英文及び翻訳例14. A method for securing an electrical subassembly (ESA) of a parallel optical communications device to an
    optical subassembly (OSA) of the parallel optical communications device, the method comprising:【請求項14】 並列光
    通信装置の電気サブアセンブリー(ESA)を前記並列光通信装置の光学サブアセンブリー(O
    SA)に固定する方法であって、 mounting a mounting device of an ESA [続きを読む]
  • 2017.07.07
  • 英文及び翻訳例13. The parallel optical communications device of claim 9, wherein the respective slots formed in the respe
    ctive lower surfaces of the respective heat dissipation blocks are greater in a width dimension than a width dimension of the resp
    ective slots formed in the upper surface of the mounting device, and wherein the respective weldable OSA inserts are greater in a
    width dimension [続きを読む]
  • 2017.07.06
  • 英文及び翻訳例12. The parallel optical communications device of claim 9, wherein the respective slots formed in the respe
    ctive lower surfaces of the respective heat dissipation blocks are smaller in a width dimension than a width dimension of the resp
    ective slots formed in the upper surface of the mounting device, and wherein the respective weldable OSA inserts are smaller in a
    width dimension [続きを読む]
  • 2017.07.05
  • 英文及び翻訳例11. The parallel optical communications device of claim 10, wherein the surface areas of the lower surfaces
    of the respective weldable OSA inserts are less than or equal to about 35% of the respective surface areas of the respective lowe
    r surfaces of the respective heat dissipation blocks.【請求項11】 前記各溶接可能なOSA挿入部の下面
    の表面積が、前記各熱放散ブロックの各下面の [続きを読む]
  • 2017.07.04
  • 英文及び翻訳例10. The parallel optical communications device of claim 9, wherein the surface areas of the lower surfaces
    of the weldable OSA inserts are no greater than 50% of the respective surface areas of the respective lower surfaces of the respec
    tive heat dissipation blocks.【請求項10】 前記溶接可能なOSA挿入部の下面の表面積が、前記各
    熱放散ブロックの各下面の各表面積の50%以下である [続きを読む]
  • 2017.07.03
  • 英文及び翻訳例9. The parallel optical communications device of claim 8, wherein the weldable OSA inserts have respective
    lowers surfaces that are generally co-planar with the respective lower surfaces of the respective heat dissipation blocks, and wh
    erein the respective lower surfaces of the respective weldable OSA inserts have respective surfaces area that are relatively small
    compared to the [続きを読む]
  • 2017.07.02
  • 英文及び翻訳例8.   A parallel optical communications device comprising: a substrate having one or more electrical conductors passing through the substrate; an electrical subassembly (ESA) mounted on the substrate, the mounting device having at least an upper surface and a lower surface, the upper surface of the mounting device having at least one integrated circuit (IC) and a plurality [続きを読む]
  • 2017.06.01
  • 英文及び翻訳例7. The parallel optical communications device of claim 1, wherein said at least one slot formed in the lower
    surface of said at least one heat dissipation block is greater in a width dimension than a width dimension of said at least one sl
    ot formed in the upper surface of the mounting device, and wherein said at least one weldable OSA insert is greater in at least a
    width dimension [続きを読む]
  • 2017.06.30
  • 英文及び翻訳例6. The parallel optical communications device of claim 1, wherein said at least one slot formed in the lower
    surface of said at least one heat dissipation block is smaller in a width dimension than a width dimension of said at least one sl
    ot formed in the upper surface of the mounting device, and wherein said at least one weldable OSA insert is smaller in a width dim
    ension than a wi [続きを読む]
  • 2017.06.29
  • 英文及び翻訳例5. The parallel optical communications device of claim 4, wherein the surface area of the lower surface of sa
    id at least one weldable OSA insert is less than or equal to about 35% of the surface area of the lower surface of said at least o
    ne heat dissipation block.【請求項5】 前記少なくとも1つの溶接可能なOSA挿入部の下面の表面
    積が、前記少なくとも1つの熱放散ブロックの下面の表面 [続きを読む]
  • 2017.06.28
  • 英文及び翻訳例4. The parallel optical communications device of claim 3, wherein the surface area of the lower surface of sa
    id at least one weldable OSA insert is no greater than about 50% of the surface area of the lower surface of said at least one hea
    t dissipation block.【請求項4】 前記少なくとも1つの溶接可能なOSA挿入部の下面の表面積が
    、前記少なくとも1つの熱放散ブロックの下面の表面積の約 [続きを読む]
  • 2017.06.27
  • 英文及び翻訳例3. The parallel optical communications device of claim 1, wherein said at least one weldable OSA insert ha
    s a lower surface that is generally co-planar with the lower surface of said at least one heat dissipation block, and wherein the
    lower surface of said at least one weldable OSA insert has a surface area that is relatively small compared to a surface area of t
    he lower surface [続きを読む]
  • 2017.06.26
  • 英文及び翻訳例2.   The parallel optical communications device of claim 1, wherein the mounting device has at least two slots formed therein at opposite ends of the mounting device, each of the slots containing the weldable ESA insert, and wherein the OSA includes at least two heat dissipation blocks secured to opposite sides of the OSA, each of the heat dissipation blocks having a slot formed in [続きを読む]
  • 2017.06.25
  • 英文及び翻訳例   CLAIMSWhat is claimed is:1. A parallel optical communications device comprising: a substrate
    ; an electrical subassembly (ESA) mounted on the substrate, the mounting device having at least an upper surface and a lower
    surface, the upper surface of the mounting device having at least one integrated circuit (IC) and a plurality of active optical de
    vices mounted there [続きを読む]
  • 2017.06.24
  • 英文及び翻訳例As will be understood by those skilled in the art in view of the description being provided herein, many modi
    fications may be made to the embodiments described herein while still providing a parallel optical communications device that achi
    eves the goals of the invention, and all such modifications are within the scope of the invention.本願でなされた説明に
    鑑みて当業者には明らかなよう [続きを読む]
  • 2017.09.23
  • 英文及び翻訳例The invention also is not limited to using any particular welding technique to create the welded joint, as wi
    ll be understood by persons of ordinary skill in the art in view of the description being provided herein.本願で提供された
    説明に鑑みて当業者には明らかなように、本発明は溶接継ぎ手を作るために、どのような特定の
    溶接技術を使用することにも限定されることはない。 翻訳者のコメント  [続きを読む]